Übersetzung für "Packaging density" in Deutsch

In particular, a high operating frequency of the circuits and a high packaging density of the components are achieved.

This packaging density is referred to the density of these materials in bulk form.

The multi-axis drives with variable motor output allocation offer optimised packaging density and costs per drive channel.

Our microminiature coax connectors offer a versatile solution for high density packaging.

The 2-channel Servo Drives with variable motor output current optimise the packaging density and the cost per drive channel.

Furthermore, by the use of only thin-walled foil as the packaging material, high packaging density is assured.

If sensor 18 signals a lengthening of the yarn plug 3, a parameter change will occur in the crimping device 2, which leads to an increase in the packaging density.

Further, the packaging density of the coating material is preferably at least 95%, preferably even at least 97%.

Besides the low packaging density, because of which a great deal of storage space is used up by the empty and filled packages, the high insurance costs for the storage space due to the danger of fire caused by the styropor, must also be mentioned.

The High Density Packaging User Group International HDPUG is an American non profit trade organization involved in the supply chain of products using high density electronic packages.

The main scientific and technical challenge of the project was to develop a technology demonstrator to show the potential of High Density Packaging (HDP) technologies.

Alternatively it is possible to keep the thickness of the electrically conductive layer constant and to reduce the width of the conductor tracks forming the RF antenna or coil, whereby the packaging density can be increased.

In that way it is possible to increase the packaging density of the security element, reduce production costs and improve the electrical properties of the security element.

In that respect the packaging density which can be achieved is increased by virtue of the fact that a relief structure is shaped not only in the top side and the underside of the wire (in relation to the substrate layer) but a relief structure is also shaped in the side surfaces of the wire.

Typical features like easy & fast assembly, high packaging density, simply installation without tools and high contact pressure remain unchanged.

The packaging density and the free channel length of the bottom plate is determined largely by the smallest possible core height and the required minimum wall thickness.

According to Lishen, the cell type 21700 for the latest generation of electrical vehicles produced at the new plant in Suzhou has decisive advantages over the conventional cell type: lighter packaging, higher energy density as well as easy production at lower cost.

Isolated converter applications – such as flyback converters – with high packaging density are also areas of use, as well as step-up or step-down converters with auxiliary windings, as are auto-transformer applications.

However, when tungsten copper alloy used as electronic packaging materials, the density must be greater than 98% theoretical density, in order to ensure high thermal conductivity, thereby increasing the density of tungsten copper alloy is the key of material properties of tungsten-copper alloy guarantee.

Increasing clock frequencies and expanding packaging density on the silicon chip, in the package and on the printed circuit boards are the reasons for the constantly increasing warming.

In order to ensure the highest technical performance and to provide an optimum solution for high density packaging, DIAMOND has developed the Diamond Micro AVIM™ based on the DMI, but with titanium components.