Übersetzung für "Bond stress" in Deutsch

When that happens, the Bond takes stress.

A further disadvantage is that, when elevated surfaces and the standard level are glued together in this way, the adhesive bond is under stress (elastic deformation).

It is assumed that the significant variable for the failure of the TBC layer is the region of mechanical stress, which is perpendicular to the interface between the TBC layer and the bond coat (normal stress ? n).

A multicomponent mortar composition with significantly elevated bond stress after curing, even at higher temperatures, such as at +80° C., and with satisfactory curing at ?5° C., is described in DE 10 2004 008 464 A1.

The adhesive spots, which are distributed irregularly over the end side of the holder in a special manner, for fastening the rotation mirror can, during a rapid rotation, due to the occurring centrifugal forces, have a negative effect on the adhesive bond, the stress states in the mirror, and the flatness of the rotation mirror, which can result in a detachment of the mirror from the holder or fragmentation of the mirror.

The measurements demonstrated that a “mean bond stress” in accordance with ISO 10406-1 is at least 20 MPa.

Comparative measurements con-ducted on reinforcement rods known from the prior art under the same conditions gave a value of less than 15 MPa for the mean bond stress.

Resistance to forces that act only on one line at the end of the bond and cause stress peaks here.

James Bond is never stressed or scared.

The bonding strengths are not sufficient to ensure permanent bonds for mechanically stressed electronic contacts.

For undertaking the process of the invention one may make use of an apparatus having at least one stressing means for acting on the free ends of the part that is to be pre-stressed and a bonding stressing bed taking up all the parts of the component parallel to each other and having pressing faces, that may be moved towards the wood, running at least along the outer parts.

The apparatus, that is of the same sort as detailed in the German Offenlegungsschrift specification No. 3,036,793 (that is designed for bonding only), firstly has a conveyor part in the form of a carriage 8 running by way of wheels 6 and 7 on rails 4 and 5 and which is used as a bonding support and stressing bed.

The adhesive bonding prevents stresses being produced during the pinning operation, for example as a result of bending or twisting in the torsion rod 10 .

The bond stresses achieved for dry drilled holes (complete cleaning) using the mortar formulations described in Example 1 as well as for moist holes with less cleaning are compiled in Table 2 below:

The measures known in the prior art, such as, in particular, potting and adhesive bonding, are stressed over time due to the different thermal expansion of individual components and, in unfavorable cases, may fail over a relatively long operating period and, in particular, adhesive bonds or potting means may tear, as a result of which the arrangement may become untight, which may result in component failure.

If rotation mirror and spring element(s) are connected to one another by means of adhesive bond, stresses and shear forces of this adhesive bond are also absorbed by the spring element or elements, which reduces the risk of failure of the adhesive bond and detachment of the rotation mirror.

In the assembly of the optical measuring device, adhesive is often used, since adhesive bonding largely avoids stresses in the optical system support being caused by assembly and can be carried out with low costs and high accuracy.

Is thus evident from the table that the mortar compositions, which show a much shorter gel time at +25° C. due to the inventive use of the novolac amine hybrid hardener, cure faster, but nevertheless achieve bond stresses, which are comparable at medium (+23° C.) and higher temperatures (+50° C.) with those of comparative anchor (HILTI RE 500) and also exceed it in the low temperature range (+5° C.).