Übersetzung für "Technical bulletin" in Deutsch

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An element of this kind is known, for example from page 3, Table II Section B of "Kevlar 49, Technical Information, Bulletin No.K-1, June 1974", of the Du Pont de Nemours Company.

This formula is also disclosed for defining the blockage index in `Technical Bulletin` No 491 of Mar. 1, 1976, issued by DuPont.

Thus, for example, "IBM Technical Disclosure Bulletin", Vol. 18, No. 6, November 1975, pp. 1867 to 1870, describes a method whereby the reflection of a light beam obliquely incident upon the workpiece is measured and used as a criterion to terminate a development or etch process.

Furthermore, CCD storage systems utilizing multi-valued signals or multilevels of charge at a given storage location to represent three or more binary digits of information are also known as, for example, disclosed in IBM Technical Disclosure Bulletin, Vol. 20, No. 8, January 1978, pp. 3011-3013, in an article entitled, "Converter for CCd Multilevel Shift Registers" by H. S. Lee.

Also, means for producing fractional charge packets are disclosed in the H. S. Lee article as well as in IBM Technical Disclosure Bulletin, Vol. 20, No. 8, Jan. 1978, pp. 3014-3016, in an article entitled "Fractional Charge Paket Generator" by J. A. Hiltebeitel and N. G. Vogl, Jr. by storing a given quantity of charge in a particular well and then directing one half of the given quantity of charge into each of two adjacent wells.

This circuit is known as a "THREE-STATE PUSH-PULL DRIVER" described in IBM Technical Disclosure Bulletin, Vol. 21, No. 1, June 1978, p. 172.

It has also been taught by Antonucci et al in the December, 1978 (Vol. 21, No. 7) issue of IBM's Technical Disclosure Bulletin at pages 2910-11, that a controlled growth of dendrites can be utilized to increase the tensile strength and decrease the electrical resistance of the solder ball joint between chip and substrate in a module.

A PLA with transistors at the cross points is described in the IBM Technical Disclosure Bulletin, July 1976, pp. 588 to 590.

In contrast to the arrangement described in the journal IBM Technical Disclosure Bulletin, the feed-in device according to the invention offers the advantage that no motion of the stack or roll is necessary when making a transition from one continuous form to another.

However, it was found that this approach was successful only if great care was taken in positioning the individual particles and the particles were fixed in their place with considerable effort (see in this connection, the patent cited at the outset, according to which metal bodies are to be placed on conductor runs and are to be fastened by thermal pressure metallization or the like, and also see "IBM Technical Disclosure Bulletin" 19 (1977) 3006 or 20 (1978) 3496, according to which glass particles are placed in substrate depressions or put in the space provided by a distribution template and tacked-on by melting a substrate coating).

However, this method described in IBM Technical Disclosure Bulletin, Vol. 18, No. 7, p. 2069 requires a recess surface that is precisely vertical, i.e. that extends at right angles to the surface of the workpiece, as well as the means for microscopic observation.

In the case of multiple disturbances, the prior art attempted reconfigurations of at least one data transmission path to interconnect as many interconnection units as possible. It is known (for example, for DE-PS No. 25 52 953 or from IBM Technical Disclosure Bulletin Vol. 21, No. 8, January 1979, pages 3349 to 3350) to provide each interconnection unit with more than two data connections.