Translation of "Strukturierung nach" in English

The auxiliary layer is removed after the structuring of the insulating layer.

After structuring the metal layers, the stop layers disposed thereon can be removed.

FIG. 7 shows the SOI substrate after structuring of the bottom resist layer and the first diffusion barrier layer.

Conceivable is a structuring logic according to manufacturers or device groups (type designation).

The patterning, therefore, can be performed at low cost after the installation of the necessary apparatus.

FIG. 2 illustrates a substrate after structuring of the mask layer upon employment of the nuclei as an etching mask.

Owing to the structuring as claimed in claim 6, different capacitors can be implemented in one layer.

This method allows structuring to take place immediately after depositing the first electrode layer, but also beforehand.

He explores questions of the segmentation and structuring of the visual space as well as contemporary issues in the politics of representation.

Structuring according to the European standard (EN) and the globally valid ISO standard.

The business organisations display transport companies organised structurally by billing-related and customer-information-related features.

In accordance with the substrate texture, there is formed on the substrate a metal foil with the desired negative texture which, after the required layer thickness has been achieved, is detached from the substrate and then operates as the carrier member.

In accordance with the substrate texture, there is formed on the substrate a metal foil with the desired negative texture which, after the required layer thickness has been achieved, is detached from the substrate and then operates as the carrier member.

Advantageously, the structuring of the electrode is carried out according to microstructuring methods which are known per se and which are used, for example, for the structuring of semiconductor components.

FIG. 11 shows a top view of the substrate of FIG. 10 after the structuring of the conductive layer for the formation of wordline segments.

FIG. 9 shows a section through the semiconductor substrate after structuring of the first insulating layer for the formation of supporting structures and spacers;

However, polyimides of that type do not have a sufficient transparency (after the heat-treatment). Moreover, for patterning or structuring of the precursors, it is necessary to work according to the negative mode and the development must be effected by using organic solvents.

As a function of the structuring of said paths, e.g. as a function of their length, more or less differently structured conductive layers are interconnected.

In the method according to the present invention, the structuring takes place preferably according to the following techniques which offer the best resolution with good process tolerances:

If, in the case of the film, both sides do not have the characteristic surface structure, the film should be applied in such a way that the side having the structuring points outward and the smooth side, which does not have any surface structuring, faces the surface, to be antireflection treated, of the object.

FIG. 2 is a sectional view through the substrate after structuring of a mask layer for the purpose of defining first regions and second regions;

At the end of this structuring, e.g. at the end of a specific erosion time, the microwave transmitter 8 is switched off, the gas supply stopped and the container 2 ventilated in order to remove the polymer films.

The major reorganisation that took place has helped to reduce the number of accredited collection agencies (their number has been reduced by about two thirds, which has led to regrouping in many sectors), and their creation by branches of industry on a principal basis at national level and at the inter-industry regional level on a complementary basis.

A thin nontacky release layer (2a), which in the case of photochemical structuring is removed after the imagewise exposure and in the case of mechanical structuring is peeled off or washed off before or after imagewise cutting, may be present between the photosensitive recording layer (2) and the protective film (3).

Thereby, it is possible to keep the bonding wire sufficiently short but also, at the same time, to take variations in the localisation of the focal points into account after structuring of the metal substrate, and to place the cell in a correspondingly offset manner.