Übersetzung für "Thermal impedance" in Deutsch

Next, calculate the largest permissible thermal impedance between the junction and ambient air.

The fall-off over time of the voltage curve is therefore a measure of the thermal impedance of the semiconductor component.

However, during the dissipation of high power losses from the active semiconductor parts, the high inner thermal impedance of the modules which is caused to a great extent by the insulating ceramic substrates, is disturbing.

In addition, in order to provide electrical insulation and low thermal impedance at the same time, expensive beryllium oxide is used which is toxic as a dust, thereby causing scrapping problems.

In all such techniques it is important that an intimate, large area, firm contact be made between the heat-conducting element and the device in order to reduce the usual relatively high thermal impedance that exists at the interface.

It is accordingly an object of the invention to provide a semiconductor power module which overcomes the hereinafore-mentioned disadvantages of the heretofore-known devices of this general type, to improve the heat dissipation in semiconductor power modules with substrates formed of metallized aluminum oxide ceramics and solderedon semiconductor power components and to reduce the inner thermal impedance between the active silicon part and the base of the housing.

The grooves may be replaced, for instance, by zones in the temperature regulating block comprising a thermal conductivity, or impedance, different from other block regions.

By thinning the material of the temperature regulating block, its thermal conductivity is reduced, i.e., its thermal impedance is raised.

To implement the same temperature gradient at groove 38, higher thermal impedance, namely a deeper groove, is required.

These grooves reduce locally the material cross-section of the thermostated block 8 and assure a local increase in thermal impedance of the otherwise thermally well-conducting, illustratively metallic block, in the direction of heat flow in this block from the heating heat regulating device 20 to the cooling heat regulating device 19 .

To generate the same temperature gradient at the position of the groove 38, a higher thermal impedance, that is a deeper groove, is required.

All in all, over the entire range of heat supply, which is split up into a nuclear and a fossil part, the smallest possible energy losses, and therefore the smallest possible efficiency loss in the conversion of heat into electricity as the result of poor thermal impedance adaptation, will thus occur.

Furthermore the material characterises itself by a very good thermal conductivity with a low thermal impedance as well as a wide range of operating temperatures.

The fall-off over time of the voltage curve directly reflects the thermal impedance and the state of the packaging.

In this way, for example the technical advantage is achieved that a thermal impedance can be determined that can be used as a further criterion for assessment.

The degradation of the packaging over the operating life of converter 100 results in a reduction in the mechanical contacting, and thus to a detectable increase in the thermal impedance.

Aging of the packaging results in a higher thermal impedance due to a reduction of the contacting surface.

High quality material of pads, glues and other accessories ensures surfaces with low thermal impedance, which evenly dissipate heat between connected components and heat sinks, and other cooling surfaces.

If the largest permissible temperature rise is 75°C and the Watts dissipated in the TO-220 package is 2.78 W, the largest permissible thermal impedance would be 27°C/W (calculated as 75°C ÷ 2.78 W).

During the moistening air escapes out of the area of the boundary layer, which leads to a significant reduction of the thermal impedance and simultaneously to an optimal heat transfer resistance.