Übersetzung für "Surface etching" in Deutsch

After de-coating, the tape is etched with the electrodeposited surface as an etching protection.

This can be a sand-blasted surface and/or a surface modified by etching.

In addition, the activation of the surface reached by etching facilitates an integrating osteogenesis.

The roughness of the surface after etching for 1h can reach 1.50.

In particular, surface etching on all sides will then be possible only if the individual substrates perform rotatory movements.

Suitable activation methods are, for example, surface etching, increasing the surface area or chemical modification of the inside surface of the gelling mould.

In individual cases it has proven to be appropriate to roughen the substrate surface, especially by etching,

In the final stage of production, the Damascus pattern is made visible through surface etching.

In contrast, resist layers on control wafers which had only a normal postbake or which contained an added peroxide in the composition showed a rough, pitted surface after plasma etching.

After surface etching, a nickel-passivation layer forms unexpectedly at the nickel-resist edge, which prevents such undercutting.

The present invention relates to a method of processing surfaces including particularly the etching of copper or copper alloy surfaces, by means of an acidic solution containing an oxidizing agent. After removal of the copper surface, the etching solution is passed, for regeneration of the oxidizing agent, through an electrolysis cell containing an anode and a cathode, whereby the copper is etched away from the surface and is recovered at the cathode.

Those ions which strike the surface to be etched serve to knock atoms off the surface thereby gradually etching through the material.

Type belt 3 consists of steel and shows types 21 and timing marks 22 protruding from the type belt surface owing to etching or embossimg.

Furthermore, when structuring the surface by etching which takes place ahead of the second implantation, only the polycrystalline layer and the oxide layer need be removed.

Cleaning of the tantalum oxide layer surface by sputter etching and annealing at a temperature of up to 400° C. has proved to be especially favorable.

Briefly, the invention may be described as an improvement in the making of an endless metallic press band having an embossing pattern thereon particularly for use in double band presses for manufacture of laminates having textured surfaces, said endless band being formed with a transverse weld seam, the improvement comprising that the endless press band consists essentially of a metal alloy which can be precipitation hardened or altered in its crystal structure by heat or radiation treatment and that after hardening or after treatment the metal structure at the weld seam is identical with the unwelded base material to the extent that no hardness and crystal structure differences which might impair the textured depth will result when texturing the surface by knurling, etching or mechanical engraving.

Laserinterferometers can now also be employed in cases of a very small ratio of etching surface to masking surface.

By applying the completely structured contact that comprises a closed, planar surface as etching mask, difficulties that would arise in the manufacture of a photoresist mask on the surface of the substrate having the hole structures are avoided when structuring the doped polysilicon layer.

In reactive ion etching (RIE), the chemical etching reaction should be initiated only by ions produced in the plasma which impinge at right angles to the etching surface.