Übersetzung für "Ambient oxygen" in Deutsch

The ambient oxygen was removed by repeated evacuation and gassing with nitrogen.

In fact, an oxygen ambient could be used if simultaneous oxidation of the polysilicon is desired.

For the enrichment of the air with oxygen ambient air under pressure is conducted over nitrogen-absorbing zeolites.

Filling the case with a protective gas keeps ambient oxygen and other corrosive gases at bay.

A silicon dioxide layer (not shown) is formed by conventional techniques of either thermal growth at a temperature of 970° C. in wet or dry oxygen ambient or by chemical vapor deposition.

A silicon dioxide layer 16 is formed by the conventional techniques of either thermal growth at a temperature of 970° C in a wet or dry oxygen ambient or by chemical vapor deposition.

A silicon dioxide layer 36 is formed by the conventional techniques of either thermal growth at temperatures of between 900° C. to 1000° C. in a wet or dry oxygen ambient or by chemical vapor deposition.

Of course, a specific danger always remains associated with the operation of alkaline cells: their susceptibility to in-flowing ambient oxygen, CO2, or even inwardly diffusing water.

When, as is described in the above European Publication No. 0037,461, a single-component material is cured by means of light, a greasy layer will form on the surface of the material if oxygen is present in the ambient atmosphere, because oxygen molecules inhibit the polymerization.

Tribochemically activated particles may emerge from the surface, which then react spontaneously with the oxygen in the ambient air, or oxygen used as working medium, such as in oxygen compressors.

The sensors described in the two above-mentioned documents relate to the detection of hydrocarbons exclusively in high-oxygen gases, for example, in ambient air (oxygen proportion approximately 20%).

The action of components of the ambient air (oxygen, carbon dioxide) influences the conductivity of the developer to a relatively small extent but has a major effect on the activity of the developer.

Accordingly, any product rest which has not been completely ejected from the outlet duct can come into contact with contaminating and harmful germs, bacteria or viruses contained in the ambient air and with aggressive gases which are harmful for the product, particularly ambient oxygen.

Oxidation products are inevitably produced in the transition area from the pickling stage through the rinsing and drying stage into the furnace entrance due to the influence of ambient oxygen.

The quantity and formation of the oxidation products entering the furnace and the ambient oxygen entrained by the strip determine the necessary method parameters of the treatment procedure, characterized by a required reduction potential, temperature level and holding time.

The measures according to the invention maintain the optimum strip condition after pickling up to the heating furnace because the introduction of ambient oxygen is prevented.

Consequently, a product rest remaining in the outlet duct cannot come into contact with harmful germs, bacteria, viruses, etc. and with harmful materials, such as gases, particularly ambient oxygen.

The effects of the various technological processes on the nutritive value of a foodstuff can very often be anticipated once the influenoe of various factors, such as pH, ambient oxygen, temperature and light, on the stability of the different nutrients is known (Table l)

The effectB of the various technological processes on the nutritive value of a foodstuff can very often be anticipated once the influence of various factors, such as pH, ambient oxygen, temperature and light, on the stability of the different nutrients is known (Table l)