Übersetzung für "Königswasser" in Englisch

The unreacted platinum is then removed by etching in aqua regia.

When the platinum catalyst is laden with a large amount of heavy metals, the metal impurities can be dissolved in aqua regia.

Furthermore, it is known to dissolve such ores with aqua regia.

It is highly resistant to corrosion in sea water, aqua regia and chlorine.

It does not dissolve in hydrochloric, nitric and sulfuric acid and in aqua regia.

From here, 0.5 g of the sample is digested with aqua regia for 2 hours at 95 °C.

We describe a method that works with two old memory modules and 20 drops of aqua regia.

So the librarians find out and they get together a special solution, a chemical solution called King's Water, that when mixed with 99 stones would be able to save all that culture and history in the books.

We need a cool bag with Three bottles of beer, an umbrella, The old stone sling of Børge, A huge glass ball, Two gum and something Royal water.

One wafer was set aside as a control and another was etched for 20 minutes in freshly prepared aqua regia followed by a D.I. water rinse.

The unreacted platinum, including that which is atop nitride layer 21, is then removed by etching, typically in aqua regia.

Noble metal catalyst, in particular platinum catalysts, which are applied on carriers and have become poisoned by metals as a result of being used for many years in the preparation of hydroxyl-ammonium salts by catalytic reduction of nitric oxide with hydrogen in an aqueous mineral acid are regenerated by a process in which the metallic impurities are dissolved using nitric acid or aqua regia, the solution is neutralized, the troublesome metals are precipitated from the neutralized solution by means of a selective precipitating reagent, and the purified platinum solution is reused for the preparation of the catalyst.

When the precipitate has been separated off, the filtrate can be suspended with the prepurified catalyst in dilute aqua regia, and the suspension further processed.

For further concentration of the metal impurities, it is advantageous to suspend the catalyst in a nitric acid/hydrochloric acid mixture (aqua regia).

Hence, if in accordance with the process of the invention, the arrangement is dipped into aqua regia, the platinum which has not been used up by the formation of a silicide is removed, but will remain on the electrodes. In the case of a further embodiment of the process according to the invention dealing with the fabrication of conductor patterns, layers of platinum silicide on the conductor leads and on the electrodes which show considerably lower lead-in resistance than would be possible to achieve with merely doped polycrystalline layers.

If it is in any case intended to replace the carrier, selective precipitation of the metals may also be carried out directly after suspending the old catalyst in aqua regia and neutralizing the suspension.

A composite was thereby obtained which had a roughened platinum surface and which, after etching with aqua regia, gave an electrode which, in the case of persulphate electrolysis, gave yields like massive platinum.

The unreacted platinum, including that which is atop oxide layer 10, is then removed by etching in aqua regia.

As previously noted, the aqua regia may also attack localized regions of the platinum silicide to expose the silicon.

Instead of the direct use of transition metal salts, the transition metals can also be used in elementary form by, for instance, dissolving platinum shavings and copper wire in aqua regia.

Because the SiO2 is thin and porous, the aqua regia also may attack localized regions of the PtSi, thereby exposing the N+ or N type silicon in contact regions exposed beneath the PtSi.

Through a subsequent etching step, for example isotropic wet chemical etching with aqua regia made up of 3 parts HCl and one part HNO 3, any undesired edge coverage by the electrode layer 8 can be removed. In this case the etching step may, however, then take place substantially faster and with less stringent requirements on selectivity, edge gradient or etching rate, than is usually the case for structuring the electrode layer 8 .