Translation of "Bedrahtete bauteile" in English

All SMD components are already soldered, only a few wired components have to be soldered.

Even today, wired components are still often assembled using wave soldering – in keeping with the tradition of times past.

All pads should appear on one of these layers (SMT) or both (for through hole) to prevent the varnish from covering the pads.

Separate test runs are designated for SMD-mounting, THT-mounting (wired parts), as well as the bottom of the PCB.

Wired components, in this sense, can, therefore, also include row sockets, connection wires or litz wires, and even transformers and other active, or passive, electronic components.

It has been found that wired components of the described kind on jolting or jerking conveyor belts can shake out of the circuit board on the way to, or through, an automatic soldering facility.

Especially in the case of the latter, it provides the assurance that, even in the case of the new, so-called “upside-down soldering”, also called the “backside-reflow” method, thermally critical, wired components hanging upside-down and beneath the circuit board in the reflow soldering oven do not fall out of the connection bores.

One of the structures shown there is a solid state relay, as a wired component which can be soldered to a circuit board.

Increasingly, wired electronic components are being replaced by wireless Surface Mounted Devices, and modern printed circuit boards therefore have a fairly large number of through-plated holes that do not accommodate any electronic components.

For through-hole parts drills can be offset inside the pad and be round or a slot.

However, there are also leaded components, especially connectors that have leads of varying width and/or length that are also in irregular locations.

To fit the sensor boards at right angles in narrow space, some through-hole components were also replaced by SMT parts.

Vice versa, the position of these wired components determines the top side of the respective circuit board.

Advantageously, through-plated multi-layer printed circuit boards provide a better hold and a more reliable connection of wire-leaded electronic components.

Secondly, difficulties arise because the same soldering process is not suitable for soldering the two different types of components onto the same side of the same circuit board. Namely, a reflow soldering process that is suitable for soldering the surface mount devices cannot be used for soldering the wired devices onto the board.

While most leaded devices and simple BGAs have elements arranged in very simple patterns that are equally simple to define, more and more component designers are using designs that are very complex and often times nearly random.

You can use it as a good aid to soldering through-hole components, but for SMD components its magnification too low.

The invention relates to a circuit board having a holding mechanism for holding electronic components, a method for manufacturing such a circuit board, and their use in a soldering oven.

The term “wired components” is meant here to include all components having at least one connection wire or connection pin, which is stuck through, or into, as the case may be, a corresponding, ordinary connection bore, or hole, of the circuit board and soldered to, or with, as the case may be, a desired contact location, in order to provide electric contacting of the component.

There have even been instances where these components were pressed out of the circuit board by the soldering wave of a wave soldering facility.

One important feature of the KE2060R is that it uses an advanced vision system allowing the operator to automatically “learn” the ball or lead patterns of even the most complex BGAs, leaded components, and connectors saving valuable time and improving placement accuracy.