Translation of "Tetrafluormethan" in English

Additional reactive fluorine gases include tetrafluoromethane and other fluorocarbon or fluorohydrocarbon substances.

Suitable saturated fluorocarbon compounds are, for example, tetrafluoromethane and hexafluoroethane.

Fluorinated gases like tetrafluoromethane may also be added.

Additional suitable reactive fluorine gases are tetrafluoromethane and other fluorocarbon material or fluorohydrocarbon materials.

Tetrafluoromethane, also known as carbon tetrafluoride, is the simplest fluorocarbon (CF4).

Fluorides This subheading includes the following compounds: carbon tetrafluoride (tetrafluoromethane), 1,1­difluoroethane, tetrafluoroethylene,. trifluoro­ethylene, trifluoromethane.

Oxygen, nitrogen, tetrafluoromethane, octafluorocyclobutane, carbon dioxide and hydrogen fluoride are preferred reactive gases.

Examples of such gases are silane, disilane, dichlorosilane, germane, borane, arsine, hydrogen chloride, ammonia, tetrafluoromethane and various metallic organic compounds.

The cells may contain any gases which are inert to caprolactam, eg. helium, argon, ethane, propene, difluorodichloromethane, tetrafluoromethane, hexamethylenedisilane, etc.

The arrangement was then etched in a plasma reactor with a gas mixture composed of tetrafluoromethane plus 10 (volume) percent oxygen given a bias voltage of 450 volts and a gas pressure of 30 mTorr.

However, when applied as process gas in a plasma, SF6 generates highly reactive fluorine atoms and sulfur fluoride radicals. Hence, SF6 constitutes one of the most aggressive plasma process gases (see tetrafluoromethane).

Preference is given to using gases which do not react with dinitrogen monoxide, for example nitrogen, helium, neon, argon, krypton, xenon, hydrogen, carbon monoxide, methane and tetrafluoromethane.

The process for purifying the gas mixture comprising dinitrogen monoxide according to claim 5, wherein the gas mixture M-1 is selected from the group consisting of nitrogen, helium, neon, argon, krypton, xenon, hydrogen, carbon monoxide, methane and tetrafluoromethane.

In a further embodiment, the present invention therefore also relates to a process as described above for purifying a gas mixture comprising dinitrogen monoxide, wherein the gas mixture M-1 is selected from the group consisting of nitrogen, helium, neon, argon, krypton, xenon, hydrogen, carbon monoxide, methane and tetrafluoromethane.

Use may also be made, however, of low-boiling, optionally halogen-substituted hydrocarbons such as methane, ethane, propane, butane, isobutene, propene, ethane, or tetrafluoromethane, trifluoromethane, difluoromethane, and fluoromethane, and also mixtures of different gases.

The apparatus in accordance with claim 10, wherein the sputtering gas comprises and/or consists of a noble gas; and/or the reactive gas comprises or consists of a gas selected from oxygen, nitrogen, tetrafluoromethane, octafluorocyclobutane, carbon dioxide and hydrogen fluoride.

It has been found that tetrafluoromethane and hexafluoroethane can be used well for fluorination of SiO 2 -containing soot bodies, since these fluorohydrocarbons, unlike the common fluorination agent SiF 4, show good handling properties and no toxicity, are inert at room temperature and are comparatively inexpensive.

However, it is disadvantageous that the use of tetrafluoromethane or hexafluoroethane requires relatively high temperatures for thermal decomposition, and is associated with the formation of a reactive fluorine-containing entity.

The generation of soot during the fluorination with tetrafluoromethane or hexafluoroethane has a disadvantageous effect on the method and the quality of the soot bodies and/or quartz glass thus made.

BRIEF SUMMARY OF THE INVENTION Surprisingly, it has been found that upon addition of hydrogen to the fluorohydrocarbons, tetrafluoromethane or hexafluoroethane, the formation of reactive fluorine-containing entities takes place at clearly lower temperatures.