Übersetzung für "Durchkontaktiert" in Englisch

The metal conductors 31 are contacted through to the contact surfaces 20 on the front side.

The coils of the two foil sides are electrically interconnected from the upper to the lower side.

The solder pads 25 are through-plated towards the bottom side of the printed-circuit board 2 (FIG. 6).

The board is through-plated at the electrical contact areas.

In the first exemplary embodiment, the fastening hole 5 and the additional holes 6 are through-plated.

The PCBs are tin-plated, plated-through and manufactured RoHS conform (lead-free).

Both conductors 501 and 503 are through-plated at a location 505 and are connected to each other.

In this case, provision is preferably made for the ground areas of the two outer layers to be through-plated at regular intervals.

In addition, provision is preferably made for the printed circuit board to be plated-through.

The printed circuit board 2 is, however, not through-plated within the fastening hole 5 in the second exemplary embodiment.

It has two layers, vias are manually made, 0.8mm diameter with 0.5mm drilling.

There now follows a discussion of a mechanical multi-microcontactor with needles for deforming the contact bridges and connecting two conductors of a crossover, with which a complete array of the substrate can be simultaneously contacted.

Subsequently, through-hole plating of the boards will be effected by producing with the aid of galvanic means metal coatings on the inner surfaces of the holes 16.

Furthermore, these flat coils are connected with each other by way of their outermost and innermost windings, the transition from the outermost windings being located at the crease and the innermost windings being joined together so that the flat coils are disposed almost in congruence on the front side as well as on the rear side, and the transition of the innermost coils being effected by a metallized path extending through the carrier material.

After a copper-plating it was clear that the holes remained uncovered, and thus the board had not been through-hole-plated.

In said method, the bores having already been provided with through-contacts (vias) and the conductive tracks are covered with a protective layer of photoresists (tenting).

It is therefore not necessary in accordance with the invention for contact to be made by drilling holes in the carrier or base plate of the pressure sensor.

The passages 9 are advantageously through-contacted i.e. continuously covered with a conductive material which is electrically conductively connected with appropriate conductor tracks at the printed circuit board.

After removal of this remaining photoresist and etching away of the thin metal layer, conductor tracks remain on both sides of the plate which are electrically separated from one another and are respectively through-plated via the control perforations.

Then, the holes are generated and contacted through (holes plated by means of copper) so that test specimens are generated, the test points of which have a defined test spacing of 275 ?m between the respective plated through hole and the inner circuitry layer.

The inventive arrangement can be also readily employed for making contact at contact locations whose bores are not through-contacted.

If such a multi-microcontactor is positioned over the substrate in such a way that the needle matrix coincides with the crossing matrix, so that through the axial movement of individual needles the corresponding crossover points can be contacted, then several contacts can be created at once.

Providing for an electrically insulating cover part on which two connection electrodes are arranged in lossproof fashion, the first connection electrode having through contact made to it from outside and being electrically connected to a first countercontact for the switching mechanism provided on the cover part on its inner side;